Bennett, NS;Cowern, NEB;Smith, AJ;Gwilliam, RM;Sealy, BJ;O'Reilly, L;McNally, PJ;Cooke, G;Kheyrandish, H

2006

October

Applied Physics Letters

Highly conductive Sb-doped layers in strained Si

Published

18 ()

SILICON DIFFUSION JUNCTIONS MOBILITY

89

The ability to create stable, highly conductive ultrashallow doped regions is a key requirement for future silicon-based devices. It is shown that biaxial tensile strain reduces the sheet resistance of highly doped n-type layers created by Sb or As implantation. The improvement is stronger with Sb, leading to a reversal in the relative doping efficiency of these n-type impurities. For Sb, the primary effect is a strong enhancement of activation as a function of tensile strain. At low processing temperatures, 0.7% strain more than doubles Sb activation, while enabling the formation of stable, similar to 10-nm-deep junctions. This makes Sb an interesting alternative to As for ultrashallow junctions in strain-engineered complementary metal-oxide-semiconductor devices. (c) 2006 American Institute of Physics.

MELVILLE

0003-6951

10.1063/1.2382741