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Cherunilam J.;Rajani K.;Byrne C.;Heise A.;McNally P.;Daniels S.
Journal of Physics D - Applied Physics
Interaction of SF6 and O2 plasma with porous poly phenyl methyl silsesquioxane low-κ films
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dielectric films etching low-κ plasma interaction porosity porous low-κ
© 2015 IOP Publishing Ltd. A reduction in the κ-value of dielectric materials is of great interest today as it leads to the reduction of resistance-capacitance delays and parasitic capacitances within integrated circuits, thereby improving device performance. We have recently reported our studies on the great potential of the Poly phenyl methyl silsesquioxane (PMSQ) low-κ films (κ = 2.7 ± 0.2) for interlayer dielectric applications. Here we report on the deposition and characterisation of porous PMSQ thin films using Heptakis (2,3,6-tri-O-methyl)-β-cyclodextrin as the porogen. A reduction in the κ-value of the films was achieved as a function of the increase in porogen loading in the film. The removal of the thermally liable porogen material from the hybrid films was studied using thermogravimetric analysis (TGA) and Fourier transform infrared spectroscopy (FTIR). The change in density as a function of the porosity was studied using x-ray reflectivity techniques. The interaction of the films with pure SF6 and O2 plasmas was studied and the surface modification that occurs in the films as a result of the interaction was studied using FTIR and x-ray photoelectron spectroscopy. A change in the κ-value of the films was observed after plasma treatment which is attributed to the chemical modification of the film surface due to plasma interaction.
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